Wafer Grinder Diamond Wheel from Canada
Resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to 8472.90.50 grinders. Achieves flatness critical for device fabrication. HTS 8473.40.41.00 applies as specialized semiconductor part.
Duty Rate — Canada → United States
12%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify grind wheel RPM rating and wafer size compatibility (200mm/300mm) in import docs
• Use affidavits from manufacturer confirming sole use in semiconductor wafer grinders