8473.40.41.00/Wafer Grinder Diamond Wheel/Japan

Wafer Grinder Diamond Wheel from Japan

Resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to 8472.90.50 grinders. Achieves flatness critical for device fabrication. HTS 8473.40.41.00 applies as specialized semiconductor part.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify grind wheel RPM rating and wafer size compatibility (200mm/300mm) in import docs

• Use affidavits from manufacturer confirming sole use in semiconductor wafer grinders