Chemical Mechanical Wafer Polisher
CMP tool that simultaneously polishes and chemically etches semiconductor wafers to atomic-level flatness for device fabrication. Falls under HTS 8471.90.00.00 as semiconductor wafer preparation equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +50.0% | 50% |
| š²š½Mexico | Free | +25.0% | 25% |
| šØš¦Canada | Free | +25.0% | 25% |
| š©šŖGermany | Free | +15.0% | 15% |
| šÆšµJapan | Free | +15.0% | 15% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If predominantly chemical etching apparatus
Primarily chemical processing equipment falls under filtering/centrifugal machines.
If for continuous chemical processing lines
Integrated continuous-flow chemical plants have separate provisions.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code ā and can price the duty on it in the same conversation.
Import Tips & Compliance
ā¢ Specify polishing pad materials, slurry delivery systems, and endpoint detection
ā¢ Provide cleanroom certification and vibration isolation specifications
Related Products under HTS 8471.90.00.00
Float Zone Crystal Grower
Equipment employing the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible. Classified under HTS 8471.90.00.00 as part of wafer manufacturing apparatus for semiconductor material growth.
Semiconductor Wafer Grinder
Machine that back-grinds semiconductor wafers to precise thickness after device fabrication, using diamond wheels. Under HTS 8471.90.00.00 as wafer preparation equipment for semiconductor processing.
Silicon Ingot Wafer Slicer
Multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon ingots. HTS 8471.90.00.00 as advanced wafer manufacturing slicing equipment.
Gallium Arsenide Wafer Grinder
Specialized grinder for compound semiconductor wafers like gallium arsenide, handling brittle materials with minimal subsurface damage. Under HTS 8471.90.00.00 for semiconductor wafer preparation.
Crystal Orientation Grinder
Precision grinder that creates flats on semiconductor boules to indicate crystal orientation and doping type for wafer processing. HTS 8471.90.00.00 as boule preparation equipment.
Semiconductor Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and enable handling during fabrication. HTS 8471.90.00.00 as wafer preparation apparatus.