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8471.90.00.00/Chemical Mechanical Wafer Polisher/Canada

Chemical Mechanical Wafer Polisher from Canada

CMP tool that simultaneously polishes and chemically etches semiconductor wafers to atomic-level flatness for device fabrication. Falls under HTS 8471.90.00.00 as semiconductor wafer preparation equipment.

Duty Rate — Canada → United States

25%

Rate breakdown

9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
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Import Tips

• Specify polishing pad materials, slurry delivery systems, and endpoint detection

• Provide cleanroom certification and vibration isolation specifications

Chemical Mechanical Wafer Polisher from Canada — Import Duty Rate | HTS 8471.90.00.00