Other
Automatic data processing machines and units thereof; magnetic or optical readers, machines for transcribing data onto data media in coded form and machines for processing such data, not elsewhere specified or included: > Other
Duty Rate (from China)
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, and 9903.94.63, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Articles of iron or steel, derivative articles of iron or steel, articles of aluminum, derivative articles of aluminum, passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks and parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks, semiconductor articles, semi-finished copper and intensive copper derivative products, wood products, or medium- and heavy-duty vehicles or medium- and heavy-duty vehicle parts, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Products classified under HTS 8471.90.00.00
Float Zone Crystal Grower
Equipment employing the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible. Classified under HTS 8471.90.00.00 as part of wafer manufacturing apparatus for semiconductor material growth.
Semiconductor Wafer Grinder
Machine that back-grinds semiconductor wafers to precise thickness after device fabrication, using diamond wheels. Under HTS 8471.90.00.00 as wafer preparation equipment for semiconductor processing.
Silicon Ingot Wafer Slicer
Multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon ingots. HTS 8471.90.00.00 as advanced wafer manufacturing slicing equipment.
Gallium Arsenide Wafer Grinder
Specialized grinder for compound semiconductor wafers like gallium arsenide, handling brittle materials with minimal subsurface damage. Under HTS 8471.90.00.00 for semiconductor wafer preparation.
Crystal Orientation Grinder
Precision grinder that creates flats on semiconductor boules to indicate crystal orientation and doping type for wafer processing. HTS 8471.90.00.00 as boule preparation equipment.
Semiconductor Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and enable handling during fabrication. HTS 8471.90.00.00 as wafer preparation apparatus.
Stress Relief Wafer Annealer
Thermal processing equipment that anneals semiconductor wafers post-grinding to relieve internal stresses. Falls under HTS 8471.90.00.00 as semiconductor processing apparatus.
Automated Wafer Cleaning Station
Robotic station that cleans semiconductor wafers post-preparation using megasonic, brush, and chemical cleaning. HTS 8471.90.00.00 as integrated semiconductor processing equipment.
Wafer Thickness Measurement Gauge
In-line metrology tool that precisely measures semiconductor wafer thickness during grinding/lapping operations. Classified HTS 8471.90.00.00 as semiconductor processing control equipment.
Wafer Lapping Machine
Equipment that uses abrasive slurry on rotating platens to lap semiconductor wafers to extreme flatness before polishing. Classified HTS 8471.90.00.00 as critical wafer preparation apparatus.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski process. It falls under HTS 8471.90.00.00 as specialized semiconductor manufacturing equipment for growing semiconductor materials, classified as a data processing machine not elsewhere specified.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Falls under HTS 8471.90.00.00 as wafer preparation equipment in semiconductor manufacturing.
Wafer Slicing Diamond Saw
High-precision inner-diameter saw with diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules. Classified in HTS 8471.90.00.00 as essential wafer manufacturing apparatus.
Chemical Mechanical Wafer Polisher
CMP tool that simultaneously polishes and chemically etches semiconductor wafers to atomic-level flatness for device fabrication. Falls under HTS 8471.90.00.00 as semiconductor wafer preparation equipment.
Double-Sided Wafer Lapper
Machine that simultaneously laps both sides of semiconductor wafers using rotating lapping plates and carrier systems. Classified under HTS 8471.90.00.00 for wafer surface preparation.