Wafer Lapping Machine
Equipment that uses abrasive slurry on rotating platens to lap semiconductor wafers to extreme flatness before polishing. Classified HTS 8471.90.00.00 as critical wafer preparation apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +50.0% | 50% |
| š²š½Mexico | Free | +25.0% | 25% |
| šØš¦Canada | Free | +25.0% | 25% |
| š©šŖGermany | Free | +15.0% | 15% |
| šÆšµJapan | Free | +15.0% | 15% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general metal polishing/lapping
Non-specialized lapping equipment under general machine tools.
If classified by centrifugal function
Certain spinning surface finishing machines may shift to filtering machinery.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code ā and can price the duty on it in the same conversation.
Import Tips & Compliance
ā¢ Detail lapping slurry composition and platen conditioning systems
ā¢ Include flatness measurement system calibration certificates
Related Products under HTS 8471.90.00.00
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Equipment employing the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible. Classified under HTS 8471.90.00.00 as part of wafer manufacturing apparatus for semiconductor material growth.
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Machine that back-grinds semiconductor wafers to precise thickness after device fabrication, using diamond wheels. Under HTS 8471.90.00.00 as wafer preparation equipment for semiconductor processing.
Silicon Ingot Wafer Slicer
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Gallium Arsenide Wafer Grinder
Specialized grinder for compound semiconductor wafers like gallium arsenide, handling brittle materials with minimal subsurface damage. Under HTS 8471.90.00.00 for semiconductor wafer preparation.
Crystal Orientation Grinder
Precision grinder that creates flats on semiconductor boules to indicate crystal orientation and doping type for wafer processing. HTS 8471.90.00.00 as boule preparation equipment.
Semiconductor Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and enable handling during fabrication. HTS 8471.90.00.00 as wafer preparation apparatus.