Wafer Lapping Machine
Equipment that uses abrasive slurry on rotating platens to lap semiconductor wafers to extreme flatness before polishing. Classified HTS 8471.90.00.00 as critical wafer preparation apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +50.0% | 50% |
| š²š½Mexico | Free | +25.0% | 25% |
| šØš¦Canada | Free | +25.0% | 25% |
| š©šŖGermany | Free | +15.0% | 15% |
| šÆšµJapan | Free | +15.0% | 15% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general metal polishing/lapping
Non-specialized lapping equipment under general machine tools.
If classified by centrifugal function
Certain spinning surface finishing machines may shift to filtering machinery.
Not sure which classification is right?
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Import Tips & Compliance
ā¢ Detail lapping slurry composition and platen conditioning systems
ā¢ Include flatness measurement system calibration certificates
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