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8471.90.00.00/Wafer Lapping Machine/Mexico

Wafer Lapping Machine from Mexico

Equipment that uses abrasive slurry on rotating platens to lap semiconductor wafers to extreme flatness before polishing. Classified HTS 8471.90.00.00 as critical wafer preparation apparatus.

Duty Rate — Mexico → United States

25%

Rate breakdown

9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
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Import Tips

• Detail lapping slurry composition and platen conditioning systems

• Include flatness measurement system calibration certificates

Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8471.90.00.00