Silicon Ingot Wafer Slicer
Multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon ingots. HTS 8471.90.00.00 as advanced wafer manufacturing slicing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +50.0% | 50% |
| š²š½Mexico | Free | +25.0% | 25% |
| šØš¦Canada | Free | +25.0% | 25% |
| š©šŖGermany | Free | +15.0% | 15% |
| šÆšµJapan | Free | +15.0% | 15% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If circular saws for general material cutting
General industrial saws classified separately from semiconductor slicers.
If diamond wire imported separately
Interchangeable wire tools classified as tooling under Chapter 82.
Not sure which classification is right?
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Import Tips & Compliance
ā¢ Document wire tensioning systems and slurry recirculation specifications
ā¢ Include kerf loss calculations and wafer thickness uniformity data
ā¢ Avoid saw blade tool classification by providing complete machine documentation
Related Products under HTS 8471.90.00.00
Float Zone Crystal Grower
Equipment employing the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible. Classified under HTS 8471.90.00.00 as part of wafer manufacturing apparatus for semiconductor material growth.
Semiconductor Wafer Grinder
Machine that back-grinds semiconductor wafers to precise thickness after device fabrication, using diamond wheels. Under HTS 8471.90.00.00 as wafer preparation equipment for semiconductor processing.
Gallium Arsenide Wafer Grinder
Specialized grinder for compound semiconductor wafers like gallium arsenide, handling brittle materials with minimal subsurface damage. Under HTS 8471.90.00.00 for semiconductor wafer preparation.
Crystal Orientation Grinder
Precision grinder that creates flats on semiconductor boules to indicate crystal orientation and doping type for wafer processing. HTS 8471.90.00.00 as boule preparation equipment.
Semiconductor Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and enable handling during fabrication. HTS 8471.90.00.00 as wafer preparation apparatus.
Stress Relief Wafer Annealer
Thermal processing equipment that anneals semiconductor wafers post-grinding to relieve internal stresses. Falls under HTS 8471.90.00.00 as semiconductor processing apparatus.