Silicon Ingot Wafer Slicer from Mexico
Multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon ingots. HTS 8471.90.00.00 as advanced wafer manufacturing slicing equipment.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document wire tensioning systems and slurry recirculation specifications
• Include kerf loss calculations and wafer thickness uniformity data
• Avoid saw blade tool classification by providing complete machine documentation