Silicon Ingot Wafer Slicer from Canada
Multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon ingots. HTS 8471.90.00.00 as advanced wafer manufacturing slicing equipment.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document wire tensioning systems and slurry recirculation specifications
• Include kerf loss calculations and wafer thickness uniformity data
• Avoid saw blade tool classification by providing complete machine documentation