8471.90.00.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Equipment that uses abrasive slurry on rotating platens to lap semiconductor wafers to extreme flatness before polishing. Classified HTS 8471.90.00.00 as critical wafer preparation apparatus.

Duty Rate — Japan → United States

15%

Rate breakdown

9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.

9903.05.860%Universal product exemption (U.S. note 52(b))

9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)

Calculate with your customs value Verify classification with AI

Import Tips

• Detail lapping slurry composition and platen conditioning systems

• Include flatness measurement system calibration certificates