8471.90.00.00/Chemical Mechanical Wafer Polisher/Germany

Chemical Mechanical Wafer Polisher from Germany

CMP tool that simultaneously polishes and chemically etches semiconductor wafers to atomic-level flatness for device fabrication. Falls under HTS 8471.90.00.00 as semiconductor wafer preparation equipment.

Duty Rate — Germany → United States

15%

Rate breakdown

9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.

9903.05.860%Universal product exemption (U.S. note 52(b))

9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)

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Import Tips

• Specify polishing pad materials, slurry delivery systems, and endpoint detection

• Provide cleanroom certification and vibration isolation specifications