8471.90.00.00/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP tool that simultaneously polishes and chemically etches semiconductor wafers to atomic-level flatness for device fabrication. Falls under HTS 8471.90.00.00 as semiconductor wafer preparation equipment.

Duty Rate — Japan → United States

15%

Rate breakdown

9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.

9903.05.860%Universal product exemption (U.S. note 52(b))

9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)

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Import Tips

• Specify polishing pad materials, slurry delivery systems, and endpoint detection

• Provide cleanroom certification and vibration isolation specifications