Silicon Ingot Slicing Machine
Specialized slicer for cutting silicon ingots into wafers with inner-diameter or multi-wire saw technology, as per statistical note (b) wafer slicing saws. HTS 8465.96.0051 classification for slicing hard semiconductor materials. Produces wafers with TTV <1μm for advanced nodes.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general hard material sawing
Saws without semiconductor boule/ingot specificity classify under Chapter 84 sawing machines.
If sold as complete semiconductor processing line
When imported as part of integrated wafer fab equipment set.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify wire diameter (60-120μm) and ingot size (200-450mm) in technical specs for proper classification
• Include slurry/diamond wire consumption rates in BOM for accurate duty calculation
Related Products under HTS 8465.96.00.51
Crystal Boule Grinder
Precision grinding machine used to grind semiconductor crystal boules to exact diameters and create flats indicating conductivity type and resistivity, as defined in statistical notes for wafer manufacturing equipment. Classified under HTS 8465.96.0051 as a splitting, slicing or paring machine for hard materials like silicon boules. Essential for preparing monocrystalline semiconductor material before wafer slicing.
Semiconductor Wafer Slicing Saw
High-precision saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide, per statistical notes on wafer slicing saws. Falls under HTS 8465.96.0051 as a slicing machine for hard materials in semiconductor processing. Ensures minimal kerf loss and precise wafer thickness for device fabrication.
Wafer Edge Grinding Machine
Automated grinder for profiling and chamfering edges of semiconductor wafers to prevent chipping during handling and processing. Meets HTS 8465.96.0051 as paring/slicing equipment for hard semiconductor materials post-slicing. Critical for achieving flatness tolerances in wafer preparation.
Gallium Arsenide Wafer Paring Tool
Precision paring machine for trimming GaAs compound semiconductor wafers to exact dimensions after slicing. Covered under HTS 8465.96.0051 for paring hard semiconductor materials per statistical notes. Handles brittle III-V materials without subsurface damage.
Semiconductor Wafer Lapping Machine
Double-sided lapping equipment for achieving semiconductor wafer thickness uniformity and surface flatness per statistical note (b)(C). Classified HTS 8465.96.0051 as paring/splitting machine for hard materials in wafer prep. Targets TTV <0.5μm, bow/warp <10μm.
Wafer Grinder for Backside Thinning
Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.