Semiconductor Wafer Lapping Machine
Double-sided lapping equipment for achieving semiconductor wafer thickness uniformity and surface flatness per statistical note (b)(C). Classified HTS 8465.96.0051 as paring/splitting machine for hard materials in wafer prep. Targets TTV <0.5μm, bow/warp <10μm.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured for metallographic samples
Lapping machines for lab sample prep classify under grinding/lapping machines.
If post-chemical mechanical polishing lapping
Advanced node wafer processing lappers may fall under semiconductor forming equipment.
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Import Tips & Compliance
• Specify lapping plate materials (cast iron/tin) and slurry types proving semiconductor use
• Differentiate from metallographic lappers under 9024.80 with wafer cassette documentation
• Include throughput specs (50-100 wph) matching fab production rates
Related Products under HTS 8465.96.00.51
Crystal Boule Grinder
Precision grinding machine used to grind semiconductor crystal boules to exact diameters and create flats indicating conductivity type and resistivity, as defined in statistical notes for wafer manufacturing equipment. Classified under HTS 8465.96.0051 as a splitting, slicing or paring machine for hard materials like silicon boules. Essential for preparing monocrystalline semiconductor material before wafer slicing.
Semiconductor Wafer Slicing Saw
High-precision saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide, per statistical notes on wafer slicing saws. Falls under HTS 8465.96.0051 as a slicing machine for hard materials in semiconductor processing. Ensures minimal kerf loss and precise wafer thickness for device fabrication.
Wafer Edge Grinding Machine
Automated grinder for profiling and chamfering edges of semiconductor wafers to prevent chipping during handling and processing. Meets HTS 8465.96.0051 as paring/slicing equipment for hard semiconductor materials post-slicing. Critical for achieving flatness tolerances in wafer preparation.
Gallium Arsenide Wafer Paring Tool
Precision paring machine for trimming GaAs compound semiconductor wafers to exact dimensions after slicing. Covered under HTS 8465.96.0051 for paring hard semiconductor materials per statistical notes. Handles brittle III-V materials without subsurface damage.
Wafer Grinder for Backside Thinning
Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.
Sapphire Wafer Slicer
Laser or diamond saw for slicing synthetic sapphire substrates used in LED/GaN semiconductor devices. HTS 8465.96.0051 slicing hard materials for semiconductor applications. Handles 2-4 inch boules with <5μm TTV.