Other
Machine tools (including machines for nailing, stapling, glueing or otherwise assembling) for working wood, cork, bone, hard rubber, hard plastics or similar hard materials: > Other: > Splitting, slicing or paring machines > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8465.96.00.51
Crystal Boule Grinder
Precision grinding machine used to grind semiconductor crystal boules to exact diameters and create flats indicating conductivity type and resistivity, as defined in statistical notes for wafer manufacturing equipment. Classified under HTS 8465.96.0051 as a splitting, slicing or paring machine for hard materials like silicon boules. Essential for preparing monocrystalline semiconductor material before wafer slicing.
Semiconductor Wafer Slicing Saw
High-precision saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide, per statistical notes on wafer slicing saws. Falls under HTS 8465.96.0051 as a slicing machine for hard materials in semiconductor processing. Ensures minimal kerf loss and precise wafer thickness for device fabrication.
Wafer Edge Grinding Machine
Automated grinder for profiling and chamfering edges of semiconductor wafers to prevent chipping during handling and processing. Meets HTS 8465.96.0051 as paring/slicing equipment for hard semiconductor materials post-slicing. Critical for achieving flatness tolerances in wafer preparation.
Gallium Arsenide Wafer Paring Tool
Precision paring machine for trimming GaAs compound semiconductor wafers to exact dimensions after slicing. Covered under HTS 8465.96.0051 for paring hard semiconductor materials per statistical notes. Handles brittle III-V materials without subsurface damage.
Semiconductor Wafer Lapping Machine
Double-sided lapping equipment for achieving semiconductor wafer thickness uniformity and surface flatness per statistical note (b)(C). Classified HTS 8465.96.0051 as paring/splitting machine for hard materials in wafer prep. Targets TTV <0.5μm, bow/warp <10μm.
Wafer Grinder for Backside Thinning
Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.
Sapphire Wafer Slicer
Laser or diamond saw for slicing synthetic sapphire substrates used in LED/GaN semiconductor devices. HTS 8465.96.0051 slicing hard materials for semiconductor applications. Handles 2-4 inch boules with <5μm TTV.
Polycrystalline Silicon Chunk Sizer
Grinding/sizing machine for polysilicon chunks before Czochralski growth, upstream semiconductor material processing. HTS 8465.96.0051 as paring equipment for hard semiconductor materials. Ensures uniform feedstock for crystal growth.
Silicon Ingot Slicing Machine
Specialized slicer for cutting silicon ingots into wafers with inner-diameter or multi-wire saw technology, as per statistical note (b) wafer slicing saws. HTS 8465.96.0051 classification for slicing hard semiconductor materials. Produces wafers with TTV <1μm for advanced nodes.
Crystal Boule Diameter Grinder
Machine for grinding semiconductor crystal boules to precise diameter tolerances before slicing, creating orientation flats per statistical note (a)(ii)(A). HTS 8465.96.0051 as grinding/paringsplitting equipment for hard materials. Critical for uniform wafer yield.
Wire Saw for Silicon Wafers
Multi-wire slurry saw for simultaneously slicing hundreds of silicon wafers from ingots, statistical note compliant equipment. HTS 8465.96.0051 slicing machine for semiconductor hard materials. Achieves 40-60μm kerf loss for maximum yield.