Semiconductor Wafer Lapping Machine from Mexico
Double-sided lapping equipment for achieving semiconductor wafer thickness uniformity and surface flatness per statistical note (b)(C). Classified HTS 8465.96.0051 as paring/splitting machine for hard materials in wafer prep. Targets TTV <0.5μm, bow/warp <10μm.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify lapping plate materials (cast iron/tin) and slurry types proving semiconductor use
• Differentiate from metallographic lappers under 9024.80 with wafer cassette documentation
• Include throughput specs (50-100 wph) matching fab production rates