Semiconductor Wafer Lapping Machine from Canada
Double-sided lapping equipment for achieving semiconductor wafer thickness uniformity and surface flatness per statistical note (b)(C). Classified HTS 8465.96.0051 as paring/splitting machine for hard materials in wafer prep. Targets TTV <0.5μm, bow/warp <10μm.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify lapping plate materials (cast iron/tin) and slurry types proving semiconductor use
• Differentiate from metallographic lappers under 9024.80 with wafer cassette documentation
• Include throughput specs (50-100 wph) matching fab production rates