8465.96.00.51/Silicon Ingot Slicing Machine/Japan

Silicon Ingot Slicing Machine from Japan

Specialized slicer for cutting silicon ingots into wafers with inner-diameter or multi-wire saw technology, as per statistical note (b) wafer slicing saws. HTS 8465.96.0051 classification for slicing hard semiconductor materials. Produces wafers with TTV <1μm for advanced nodes.

Duty Rate — Japan → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify wire diameter (60-120μm) and ingot size (200-450mm) in technical specs for proper classification

• Include slurry/diamond wire consumption rates in BOM for accurate duty calculation

Silicon Ingot Slicing Machine from Japan — Import Duty Rate | HTS 8465.96.00.51