Silicon Ingot Slicing Machine from Canada
Specialized slicer for cutting silicon ingots into wafers with inner-diameter or multi-wire saw technology, as per statistical note (b) wafer slicing saws. HTS 8465.96.0051 classification for slicing hard semiconductor materials. Produces wafers with TTV <1μm for advanced nodes.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify wire diameter (60-120μm) and ingot size (200-450mm) in technical specs for proper classification
• Include slurry/diamond wire consumption rates in BOM for accurate duty calculation