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8465.96.00.51/Silicon Ingot Slicing Machine/Mexico

Silicon Ingot Slicing Machine from Mexico

Specialized slicer for cutting silicon ingots into wafers with inner-diameter or multi-wire saw technology, as per statistical note (b) wafer slicing saws. HTS 8465.96.0051 classification for slicing hard semiconductor materials. Produces wafers with TTV <1μm for advanced nodes.

Duty Rate — Mexico → United States

12.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify wire diameter (60-120μm) and ingot size (200-450mm) in technical specs for proper classification

• Include slurry/diamond wire consumption rates in BOM for accurate duty calculation

Silicon Ingot Slicing Machine from Mexico — Import Duty Rate | HTS 8465.96.00.51