Silicon Ingot Slicing Machine from Germany
Specialized slicer for cutting silicon ingots into wafers with inner-diameter or multi-wire saw technology, as per statistical note (b) wafer slicing saws. HTS 8465.96.0051 classification for slicing hard semiconductor materials. Produces wafers with TTV <1μm for advanced nodes.
Duty Rate — Germany → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify wire diameter (60-120μm) and ingot size (200-450mm) in technical specs for proper classification
• Include slurry/diamond wire consumption rates in BOM for accurate duty calculation