Rebuilt Disco DFG Series Wafer Lapping Machine
A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for bulk semiconductor material prep without NC
Specific semiconductor prep machinery without numerical control uses 8486.
If not used or rebuilt
New NC finishing machines have separate statistical suffix.
If sold as complete wafer processing line
Integrated systems for semiconductor fab may classify as machines for semiconductor manufacture.
Not sure which classification is right?
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Import Tips & Compliance
• Include lapping plate specifications and abrasive compatibility docs to confirm classification as finishing machine
• For rebuilt status, submit OEM refurb certificates and calibration logs to Customs
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