Used or rebuilt
Machine tools for deburring, sharpening, grinding, honing, lapping, polishing or otherwise finishing metal or cermets by means of grinding stones, abrasives or polishing products, other than gear cutting, gear grinding or gear finishing machines of heading 8461: > Other: > Numerically controlled > Used or rebuilt
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8460.90.40.10
Used Haas CNC Wafer Grinder
A rebuilt Haas CNC vertical grinder designed for precision grinding of semiconductor wafers to achieve exact dimensional tolerances and surface flatness. Classified under HTS 8460.90.40.10 as a numerically controlled, used or rebuilt machine tool for grinding metal or cermets using abrasives, essential for wafer preparation in semiconductor manufacturing.
Rebuilt Disco DFG Series Wafer Lapping Machine
A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.
Used Okamoto ACC Series CNC Grinder for Crystal Boules
Refurbished Okamoto ACC-8/12 CNC grinder for precision grinding semiconductor crystal boules to exact diameters and flats indicating conductivity. HTS 8460.90.40.10 applies to this used NC grinding machine for metal/cermet finishing in wafer manufacturing.
Rebuilt Strasbaugh 7AA Wafer Polisher
Used Strasbaugh 7AA four-platen numerically controlled polisher for final surface finishing of silicon wafers before lithography. Classified in HTS 8460.90.40.10 as rebuilt NC polishing machine using abrasives for cermets in semiconductor processing.
Used Peter Wolters AC 200 CNC Lapping System
Refurbished Peter Wolters AC 200 double-side lapping machine with numerical control for parallel flat lapping of semiconductor wafers. HTS 8460.90.40.10 for used NC lapping machines in metal/cermet finishing per statistical notes.
Rebuilt Lapmaster Wolters Model 48NC Wafer Grinder
Reconditioned Lapmaster Wolters 48NC flat lapping/grinding machine for semiconductor wafer surface preparation to nanometer tolerances. Fits HTS 8460.90.40.10 as used NC grinding/lapping tool for cermets.