Used Haas CNC Wafer Grinder
A rebuilt Haas CNC vertical grinder designed for precision grinding of semiconductor wafers to achieve exact dimensional tolerances and surface flatness. Classified under HTS 8460.90.40.10 as a numerically controlled, used or rebuilt machine tool for grinding metal or cermets using abrasives, essential for wafer preparation in semiconductor manufacturing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lacks numerical control
Non-CNC grinding machines for semiconductor materials fall under machinery for manufacture/preparation of semiconductors.
If not used/rebuilt
New numerically controlled grinding machines are classified separately from used or rebuilt ones.
If primarily for wafer testing rather than preparation
Testing equipment for semiconductor devices is in Chapter 90, not finishing machines.
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Import Tips & Compliance
• Verify machine's 'used or rebuilt' status with detailed refurbishment records and prior usage documentation to qualify under 8460.90.40.10
• Provide CNC control certification and semiconductor application evidence to avoid reclassification to general machinery headings
Related Products under HTS 8460.90.40.10
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A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.
Used Okamoto ACC Series CNC Grinder for Crystal Boules
Refurbished Okamoto ACC-8/12 CNC grinder for precision grinding semiconductor crystal boules to exact diameters and flats indicating conductivity. HTS 8460.90.40.10 applies to this used NC grinding machine for metal/cermet finishing in wafer manufacturing.
Rebuilt Strasbaugh 7AA Wafer Polisher
Used Strasbaugh 7AA four-platen numerically controlled polisher for final surface finishing of silicon wafers before lithography. Classified in HTS 8460.90.40.10 as rebuilt NC polishing machine using abrasives for cermets in semiconductor processing.
Used Peter Wolters AC 200 CNC Lapping System
Refurbished Peter Wolters AC 200 double-side lapping machine with numerical control for parallel flat lapping of semiconductor wafers. HTS 8460.90.40.10 for used NC lapping machines in metal/cermet finishing per statistical notes.
Rebuilt Lapmaster Wolters Model 48NC Wafer Grinder
Reconditioned Lapmaster Wolters 48NC flat lapping/grinding machine for semiconductor wafer surface preparation to nanometer tolerances. Fits HTS 8460.90.40.10 as used NC grinding/lapping tool for cermets.