Numerically controlled
Machine tools for deburring, sharpening, grinding, honing, lapping, polishing or otherwise finishing metal or cermets by means of grinding stones, abrasives or polishing products, other than gear cutting, gear grinding or gear finishing machines of heading 8461: > Other: > Numerically controlled
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8460.90.40
CNC Crystal Boule Grinder
Numerically controlled grinding machine that shapes semiconductor crystal boules to precise diameters and grinds flats indicating conductivity type. Classified in HTS 8460.90.40 for its use of abrasives in metal (silicon/gallium arsenide) finishing during wafer manufacturing.
CNC Semiconductor Wafer Polisher
Precision numerically controlled polishing machine using abrasive pads/products to finish semiconductor wafer surfaces to mirror quality. Falls under HTS 8460.90.40 as a numerically controlled polishing tool for cermet/metal semiconductor wafers.
Numerically Controlled CNC Wafer Grinder
A precision numerically controlled machine tool used for grinding semiconductor wafers to exact dimensional tolerances and surface flatness prior to fabrication. It falls under HTS 8460.90.40 as a grinding machine for metal (silicon wafers) with numerical control, specifically for wafer preparation in semiconductor manufacturing.
Numerically Controlled Wafer Lapping Machine
CNC-controlled lapping equipment that uses abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness. HTS 8460.90.40 applies due to its numerical control and lapping function on metal semiconductor materials.
Numerically Controlled Cermet Finishing Machine
CNC machine for grinding, honing, and polishing cermet (ceramic-metal composite) parts used in semiconductor tools, employing abrasive stones and products. HTS 8460.90.40 covers numerically controlled finishing of cermets explicitly.
CNC Precision Deburring Machine for Wafer Carriers
Numerically controlled deburring tool that removes burrs from metal wafer carriers and semiconductor handling fixtures using abrasive methods. Classified under HTS 8460.90.40 for metal deburring with numerical control.