Other
Machine tools for deburring, sharpening, grinding, honing, lapping, polishing or otherwise finishing metal or cermets by means of grinding stones, abrasives or polishing products, other than gear cutting, gear grinding or gear finishing machines of heading 8461: > Other: > Numerically controlled > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8460.90.40.60
Numerically Controlled Wafer Lapping Machine
A precision numerically controlled machine used in semiconductor manufacturing to lap silicon wafers, achieving ultra-flat surfaces within tight tolerances for subsequent fabrication processes. It falls under HTS 8460.90.4060 as a numerically controlled grinding/lapping machine for finishing metal (silicon wafers are metallically processed). Designed specifically for preparing semiconductor wafers from crystal boules.
CNC Silicon Wafer Polishing Tool
Numerically controlled polishing machine employing abrasive slurries to finish silicon wafer surfaces to nanometer-level flatness for semiconductor device fabrication. Classified in HTS 8460.90.4060 due to its grinding/polishing function on metal surfaces using abrasives in a CNC configuration. Critical for removing defects post-lapping in wafer preparation.
Numerically Controlled Wafer Grinder for Crystal Boules
CNC grinder designed to precision-grind semiconductor crystal boules to exact diameters and flats indicating conductivity type, as per statistical notes for wafer preparation. Falls under HTS 8460.90.4060 as a numerically controlled machine for grinding metal (silicon) using abrasives. Essential step before slicing wafers from monocrystalline boules.
CNC Semiconductor Wafer Edge Profiling Machine
Numerically controlled abrasive machine for profiling and chamfering wafer edges to prevent chipping during handling and processing in semiconductor fabs. Classified under HTS 8460.90.4060 for its grinding/finishing of metal wafers using polishing products. Improves yield in wafer manufacturing workflow.
Precision CNC Lapper for Gallium Arsenide Wafers
Advanced numerically controlled lapping system optimized for compound semiconductor wafers like gallium arsenide, using specialized abrasives for flatness finishing. HTS 8460.90.4060 applies as it finishes cermet-like semiconductor materials via lapping/polishing. Used post-slicing for high-performance device substrates.
Numerically Controlled Double-Sided Wafer Polisher
CNC machine that simultaneously polishes both sides of semiconductor wafers using abrasive pads and slurries for mirror-like surface finish. Falls under HTS 8460.90.4060 as a numerically controlled polishing tool for metal wafer finishing. Key for achieving total thickness variation specs in wafer production.