Used Haas CNC Wafer Grinder from Japan
A rebuilt Haas CNC vertical grinder designed for precision grinding of semiconductor wafers to achieve exact dimensional tolerances and surface flatness. Classified under HTS 8460.90.40.10 as a numerically controlled, used or rebuilt machine tool for grinding metal or cermets using abrasives, essential for wafer preparation in semiconductor manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify machine's 'used or rebuilt' status with detailed refurbishment records and prior usage documentation to qualify under 8460.90.40.10
• Provide CNC control certification and semiconductor application evidence to avoid reclassification to general machinery headings