8460.90.40.10/Used Haas CNC Wafer Grinder/Japan

Used Haas CNC Wafer Grinder from Japan

A rebuilt Haas CNC vertical grinder designed for precision grinding of semiconductor wafers to achieve exact dimensional tolerances and surface flatness. Classified under HTS 8460.90.40.10 as a numerically controlled, used or rebuilt machine tool for grinding metal or cermets using abrasives, essential for wafer preparation in semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Verify machine's 'used or rebuilt' status with detailed refurbishment records and prior usage documentation to qualify under 8460.90.40.10

• Provide CNC control certification and semiconductor application evidence to avoid reclassification to general machinery headings