8460.90.40.10/Rebuilt Disco DFG Series Wafer Lapping Machine/Mexico

Rebuilt Disco DFG Series Wafer Lapping Machine from Mexico

A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Include lapping plate specifications and abrasive compatibility docs to confirm classification as finishing machine

• For rebuilt status, submit OEM refurb certificates and calibration logs to Customs

Rebuilt Disco DFG Series Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8460.90.40.10