Rebuilt Disco DFG Series Wafer Lapping Machine from Mexico
A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include lapping plate specifications and abrasive compatibility docs to confirm classification as finishing machine
• For rebuilt status, submit OEM refurb certificates and calibration logs to Customs