Rebuilt Disco DFG Series Wafer Lapping Machine from Germany
A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include lapping plate specifications and abrasive compatibility docs to confirm classification as finishing machine
• For rebuilt status, submit OEM refurb certificates and calibration logs to Customs