Rebuilt Disco DFG Series Wafer Lapping Machine from Japan
A refurbished Disco DFG-series numerically controlled lapping machine used to flat-polish semiconductor wafers, bringing them within precise tolerances for fabrication. Falls under HTS 8460.90.40.10 as used/rebuilt NC machine for lapping cermet/semiconductor materials with abrasives.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include lapping plate specifications and abrasive compatibility docs to confirm classification as finishing machine
• For rebuilt status, submit OEM refurb certificates and calibration logs to Customs