Engis Hyprez CNC Lapping System
Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If dedicated silicon wafer lapping
Semiconductor manufacturing equipment statistical note applies
If horizontal spindle configuration
Spindle orientation affects specific machine tool subheadings
If with integrated flatness measuring capability
Machines with significant measuring function classify as measuring equipment
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Import Tips & Compliance
• Specify diamond abrasive compatibility in technical specs; Include semiconductor wafer processing examples cautiously; Ensure proper declaration of numerical control features and software
Related Products under HTS 8460.40.40.60
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Numerically controlled lapping machine designed for precision finishing of flat metal surfaces and semiconductor wafers using abrasive slurries. Classified under HTS 8460.40.40.60 as a numerically controlled honing or lapping machine for metal or cermets, other than gear finishing types. Used in semiconductor manufacturing for wafer preparation to achieve critical flatness tolerances.
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