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8460.40.40.60/Engis Hyprez CNC Lapping System/Japan

Engis Hyprez CNC Lapping System from Japan

Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify diamond abrasive compatibility in technical specs; Include semiconductor wafer processing examples cautiously; Ensure proper declaration of numerical control features and software