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8460.40.40.60/Engis Hyprez CNC Lapping System/Germany

Engis Hyprez CNC Lapping System from Germany

Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify diamond abrasive compatibility in technical specs; Include semiconductor wafer processing examples cautiously; Ensure proper declaration of numerical control features and software

Engis Hyprez CNC Lapping System from Germany — Import Duty Rate | HTS 8460.40.40.60