Haas CNC Lapping Machine TL-1
Numerically controlled lapping machine designed for precision finishing of flat metal surfaces and semiconductor wafers using abrasive slurries. Classified under HTS 8460.40.40.60 as a numerically controlled honing or lapping machine for metal or cermets, other than gear finishing types. Used in semiconductor manufacturing for wafer preparation to achieve critical flatness tolerances.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured primarily for semiconductor wafer processing
Equipment specialized for semiconductor manufacturing falls under Chapter 84 statistical provisions rather than general machine tools
If not numerically controlled
Non-CNC lapping machines classify under the 'other' numerically not controlled subheading
If primarily for testing semiconductor devices
Testing equipment for semiconductor devices moves to Chapter 90 per statistical notes
Not sure which classification is right?
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Import Tips & Compliance
• Verify CNC control certification and precision specifications for statistical note compliance; Include detailed technical specs showing lapping function for customs classification; Ensure CE marking for EU-origin machines and proper HS annotation
Related Products under HTS 8460.40.40.60
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Numerically controlled double-sided lapping system for simultaneous finishing of both wafer surfaces to nanometer flatness. Specifically used in semiconductor wafer preparation after slicing to meet strict dimensional tolerances. Falls under HTS 8460.40.40.60 as other numerically controlled lapping machines for metal surfaces.
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Precision CNC lapping and polishing machine for flat metal components and semiconductor substrates, featuring automatic pressure and slurry control. Used for wafer surface preparation requiring extreme flatness per statistical note requirements. HTS 8460.40.40.60 classification as numerically controlled lapping equipment.
Struers LaboForce-5 CNC Lapping Unit
Compact numerically controlled lapping machine for metallographic sample preparation and small semiconductor wafer finishing. Provides automated control of lapping parameters for consistent surface flatness. Classified in HTS 8460.40.40.60 as other numerically controlled lapping machines.
Engis Hyprez CNC Lapping System
Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.
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CNC-controlled precision lapping system for semiconductor materials, geological samples, and metal surfaces requiring optical flatness. Automated lapping plate conditioning and sample loading. Classified HTS 8460.40.40.60 as numerically controlled lapping equipment.
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