Peter Wolters AC 800 CNC Lapping-Polishing Machine
Precision CNC lapping and polishing machine for flat metal components and semiconductor substrates, featuring automatic pressure and slurry control. Used for wafer surface preparation requiring extreme flatness per statistical note requirements. HTS 8460.40.40.60 classification as numerically controlled lapping equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured for polishing rather than lapping
Polishing machines have separate subheading from honing/lapping machines
If semiconductor wafer grinders, lappers, polishers
Statistical note specifically covers wafer preparation equipment
If for cermet materials primarily
Different statistical suffix for cermet-focused machines vs metal
Not sure which classification is right?
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Import Tips & Compliance
• Document dual lapping/polishing capability without emphasizing semiconductor use to maintain classification; Include numerical control certification from manufacturer; Prepare for flatness specification scrutiny by customs
Related Products under HTS 8460.40.40.60
Haas CNC Lapping Machine TL-1
Numerically controlled lapping machine designed for precision finishing of flat metal surfaces and semiconductor wafers using abrasive slurries. Classified under HTS 8460.40.40.60 as a numerically controlled honing or lapping machine for metal or cermets, other than gear finishing types. Used in semiconductor manufacturing for wafer preparation to achieve critical flatness tolerances.
Okamoto CNC Double-Sided Lapping Machine DLS-1200
Numerically controlled double-sided lapping system for simultaneous finishing of both wafer surfaces to nanometer flatness. Specifically used in semiconductor wafer preparation after slicing to meet strict dimensional tolerances. Falls under HTS 8460.40.40.60 as other numerically controlled lapping machines for metal surfaces.
Struers LaboForce-5 CNC Lapping Unit
Compact numerically controlled lapping machine for metallographic sample preparation and small semiconductor wafer finishing. Provides automated control of lapping parameters for consistent surface flatness. Classified in HTS 8460.40.40.60 as other numerically controlled lapping machines.
Engis Hyprez CNC Lapping System
Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.
Logitech PM5 CNC Precision Lapping Machine
CNC-controlled precision lapping system for semiconductor materials, geological samples, and metal surfaces requiring optical flatness. Automated lapping plate conditioning and sample loading. Classified HTS 8460.40.40.60 as numerically controlled lapping equipment.
Kemet CNC Lapping-Polishing Centre 48
Numerically controlled flat lapping and polishing centre for semiconductor wafers, automotive components, and precision optics. Features 3-axis CNC control and automatic slurry dispensing. HTS 8460.40.40.60 classification for numerically controlled lapping machines.