Peter Wolters AC 800 CNC Lapping-Polishing Machine from Mexico
Precision CNC lapping and polishing machine for flat metal components and semiconductor substrates, featuring automatic pressure and slurry control. Used for wafer surface preparation requiring extreme flatness per statistical note requirements. HTS 8460.40.40.60 classification as numerically controlled lapping equipment.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document dual lapping/polishing capability without emphasizing semiconductor use to maintain classification; Include numerical control certification from manufacturer; Prepare for flatness specification scrutiny by customs