Peter Wolters AC 800 CNC Lapping-Polishing Machine from China
Precision CNC lapping and polishing machine for flat metal components and semiconductor substrates, featuring automatic pressure and slurry control. Used for wafer surface preparation requiring extreme flatness per statistical note requirements. HTS 8460.40.40.60 classification as numerically controlled lapping equipment.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document dual lapping/polishing capability without emphasizing semiconductor use to maintain classification; Include numerical control certification from manufacturer; Prepare for flatness specification scrutiny by customs