Peter Wolters AC 800 CNC Lapping-Polishing Machine from Germany
Precision CNC lapping and polishing machine for flat metal components and semiconductor substrates, featuring automatic pressure and slurry control. Used for wafer surface preparation requiring extreme flatness per statistical note requirements. HTS 8460.40.40.60 classification as numerically controlled lapping equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document dual lapping/polishing capability without emphasizing semiconductor use to maintain classification; Include numerical control certification from manufacturer; Prepare for flatness specification scrutiny by customs