Haas CNC Lapping Machine TL-1 from Japan
Numerically controlled lapping machine designed for precision finishing of flat metal surfaces and semiconductor wafers using abrasive slurries. Classified under HTS 8460.40.40.60 as a numerically controlled honing or lapping machine for metal or cermets, other than gear finishing types. Used in semiconductor manufacturing for wafer preparation to achieve critical flatness tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify CNC control certification and precision specifications for statistical note compliance; Include detailed technical specs showing lapping function for customs classification; Ensure CE marking for EU-origin machines and proper HS annotation