Engis Hyprez CNC Lapping System from Canada
Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond abrasive compatibility in technical specs; Include semiconductor wafer processing examples cautiously; Ensure proper declaration of numerical control features and software