8460.40.40.60/Engis Hyprez CNC Lapping System/China

Engis Hyprez CNC Lapping System from China

Numerically controlled lapping system with diamond abrasive technology for finishing semiconductor wafers and precision metal components to sub-micron tolerances. Features programmable lapping cycles and in-situ measurement. HTS 8460.40.40.60 as numerically controlled lapping machine.

Duty Rate — China → United States

41.9%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Specify diamond abrasive compatibility in technical specs; Include semiconductor wafer processing examples cautiously; Ensure proper declaration of numerical control features and software