Precision CNC Wafer Backside Grinder
Numerically controlled grinder that thins semiconductor wafers from the backside to target thickness (typically 50-775 microns) using diamond abrasives on metal/cermet surfaces. Falls under HTS 8460.24.00.80 as NC grinding machine for semiconductor wafer finishing per statistical notes on wafer grinders.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If dedicated semiconductor wafer thinning machines
Backside grinding often classified specifically under semiconductor processing equipment.
If manually controlled
Non-NC wafer grinders use different subheading within grinding machines.
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Import Tips & Compliance
• Document thickness reduction capability and wafer size range (200mm, 300mm, 450mm) to verify semiconductor application
• Include stress relief grinding specifications to distinguish from simple thickness reduction machines
Related Products under HTS 8460.24.00.80
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CNC Semiconductor Wafer Surface Lapper
A numerically controlled lapping machine that achieves ultra-flat wafer surfaces critical for semiconductor fabrication by using abrasive slurries on metal or cermet surfaces. Falls under HTS 8460.24.00.80 as an NC grinding/lapping machine for finishing semiconductor wafers, distinct from gear finishing. Essential for bringing wafers within tight dimensional tolerances as per statistical notes.