CNC Semiconductor Wafer Surface Lapper
A numerically controlled lapping machine that achieves ultra-flat wafer surfaces critical for semiconductor fabrication by using abrasive slurries on metal or cermet surfaces. Falls under HTS 8460.24.00.80 as an NC grinding/lapping machine for finishing semiconductor wafers, distinct from gear finishing. Essential for bringing wafers within tight dimensional tolerances as per statistical notes.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified primarily as semiconductor wafer polishing equipment
Dedicated semiconductor polishing machines move to 8486.40 under machines for semiconductor manufacture.
If for non-numerically controlled versions
Lappers without numerical control classify in the non-NC grinding machines subcategory.
If equipped primarily for testing wafer flatness rather than lapping
Testing apparatus for semiconductor wafers falls under Chapter 90 measuring instruments.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include detailed process descriptions showing lapping for flatness tolerances in semiconductor wafer prep to distinguish from general polishing machines
• Label as 'semiconductor wafer processing equipment' on commercial invoice for proper statistical reporting
Related Products under HTS 8460.24.00.80
Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules
This numerically controlled grinding machine precisely grinds semiconductor crystal boules to the exact diameter required for wafer production and creates flats indicating conductivity type and resistivity. Classified under HTS 8460.24.00.80 as a numerically controlled grinding machine for finishing metal or cermets using abrasives, specifically for semiconductor manufacturing preparation. It falls in the 'other' category for non-gear grinding applications.
Numerically Controlled Czochralski Boule Grinder
NC grinding machine specifically designed for Czochralski method silicon boules, grinding to precise diameters post-crystal pulling for semiconductor wafer production. HTS 8460.24.00.80 as numerically controlled abrasive grinding for semiconductor boule finishing per statistical note (a)(ii)(A).
NC Float Zone Silicon Ingot Grinder
Numerically controlled grinding machine for float zone method silicon ingots, preparing surfaces for semiconductor device fabrication by abrasive finishing. Classified HTS 8460.24.00.80 for NC grinding of semiconductor materials per statistical notes on crystal preparation equipment.
Numerically Controlled Wafer Thickness Grinder
Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.
CNC Semiconductor Wafer Notch Grinder
Numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. HTS 8460.24.00.80 classification for NC abrasive grinding of semiconductor wafers.
Numerically Controlled Crystal Boule Flat Grinder
Precision NC grinding machine that creates orientation flats on silicon or gallium arsenide crystal boules to indicate resistivity and conductivity type for semiconductor wafer slicing. Classified in HTS 8460.24.00.80 as numerically controlled grinding equipment using abrasives for cermet/semiconductor finishing per statistical notes on wafer preparation.