Other
Machine tools for deburring, sharpening, grinding, honing, lapping, polishing or otherwise finishing metal or cermets by means of grinding stones, abrasives or polishing products, other than gear cutting, gear grinding or gear finishing machines of heading 8461: > Other grinding machines: > Other, numerically controlled > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8460.24.00.80
Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules
This numerically controlled grinding machine precisely grinds semiconductor crystal boules to the exact diameter required for wafer production and creates flats indicating conductivity type and resistivity. Classified under HTS 8460.24.00.80 as a numerically controlled grinding machine for finishing metal or cermets using abrasives, specifically for semiconductor manufacturing preparation. It falls in the 'other' category for non-gear grinding applications.
Numerically Controlled Czochralski Boule Grinder
NC grinding machine specifically designed for Czochralski method silicon boules, grinding to precise diameters post-crystal pulling for semiconductor wafer production. HTS 8460.24.00.80 as numerically controlled abrasive grinding for semiconductor boule finishing per statistical note (a)(ii)(A).
NC Float Zone Silicon Ingot Grinder
Numerically controlled grinding machine for float zone method silicon ingots, preparing surfaces for semiconductor device fabrication by abrasive finishing. Classified HTS 8460.24.00.80 for NC grinding of semiconductor materials per statistical notes on crystal preparation equipment.
Numerically Controlled Wafer Thickness Grinder
Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.
CNC Semiconductor Wafer Notch Grinder
Numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. HTS 8460.24.00.80 classification for NC abrasive grinding of semiconductor wafers.
CNC Semiconductor Wafer Surface Lapper
A numerically controlled lapping machine that achieves ultra-flat wafer surfaces critical for semiconductor fabrication by using abrasive slurries on metal or cermet surfaces. Falls under HTS 8460.24.00.80 as an NC grinding/lapping machine for finishing semiconductor wafers, distinct from gear finishing. Essential for bringing wafers within tight dimensional tolerances as per statistical notes.
Numerically Controlled Crystal Boule Flat Grinder
Precision NC grinding machine that creates orientation flats on silicon or gallium arsenide crystal boules to indicate resistivity and conductivity type for semiconductor wafer slicing. Classified in HTS 8460.24.00.80 as numerically controlled grinding equipment using abrasives for cermet/semiconductor finishing per statistical notes on wafer preparation.
NC Wafer Edge Profiling Grinder
Numerically controlled edge grinding machine that profiles semiconductor wafer edges to precise specifications, preventing chipping during handling and processing. HTS 8460.24.00.80 classification for NC abrasive grinding machines finishing semiconductor wafers, supporting statistical note on wafer preparation equipment.
Precision CNC Wafer Backside Grinder
Numerically controlled grinder that thins semiconductor wafers from the backside to target thickness (typically 50-775 microns) using diamond abrasives on metal/cermet surfaces. Falls under HTS 8460.24.00.80 as NC grinding machine for semiconductor wafer finishing per statistical notes on wafer grinders.
CNC Gallium Arsenide Wafer Polisher-Grinder
Numerically controlled combination grinder-polisher for gallium arsenide compound semiconductor wafers, achieving surface finish for epitaxial growth. HTS 8460.24.00.80 as NC abrasive finishing machine for cermets per statistical notes covering gallium arsenide processing.