Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules
This numerically controlled grinding machine precisely grinds semiconductor crystal boules to the exact diameter required for wafer production and creates flats indicating conductivity type and resistivity. Classified under HTS 8460.24.00.80 as a numerically controlled grinding machine for finishing metal or cermets using abrasives, specifically for semiconductor manufacturing preparation. It falls in the 'other' category for non-gear grinding applications.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not specifically for semiconductor boule preparation or lacks numerical control
General grinding machines not dedicated to semiconductor processing fall under machines for semiconductor manufacture in 8486.
If not numerically controlled
Non-numerically controlled grinding machines for similar semiconductor applications classify under the non-NC subcategory.
If primarily for precision measurement/testing rather than material removal
Equipment focused on testing semiconductor wafers rather than grinding falls in Chapter 90 for measuring/testing instruments.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Verify machine includes numerical control certification and specify semiconductor boule grinding capability in import documentation to avoid reclassification
• Provide technical specs confirming abrasive-based grinding for cermets/semiconductors; common pitfall is misclassifying as general metalworking equipment
• Ensure end-use statement for semiconductor manufacturing to qualify for potential duty relief programs
Related Products under HTS 8460.24.00.80
Numerically Controlled Czochralski Boule Grinder
NC grinding machine specifically designed for Czochralski method silicon boules, grinding to precise diameters post-crystal pulling for semiconductor wafer production. HTS 8460.24.00.80 as numerically controlled abrasive grinding for semiconductor boule finishing per statistical note (a)(ii)(A).
NC Float Zone Silicon Ingot Grinder
Numerically controlled grinding machine for float zone method silicon ingots, preparing surfaces for semiconductor device fabrication by abrasive finishing. Classified HTS 8460.24.00.80 for NC grinding of semiconductor materials per statistical notes on crystal preparation equipment.
Numerically Controlled Wafer Thickness Grinder
Precision NC grinder maintaining uniform wafer thickness across 300mm+ diameters for semiconductor processing, using diamond wheels on metal surfaces. Falls under HTS 8460.24.00.80 per statistical note on wafer grinders, lappers, polishers for dimensional tolerances.
CNC Semiconductor Wafer Notch Grinder
Numerically controlled machine grinding precise notches in semiconductor wafers for crystal orientation identification during processing. HTS 8460.24.00.80 classification for NC abrasive grinding of semiconductor wafers.
CNC Semiconductor Wafer Surface Lapper
A numerically controlled lapping machine that achieves ultra-flat wafer surfaces critical for semiconductor fabrication by using abrasive slurries on metal or cermet surfaces. Falls under HTS 8460.24.00.80 as an NC grinding/lapping machine for finishing semiconductor wafers, distinct from gear finishing. Essential for bringing wafers within tight dimensional tolerances as per statistical notes.
Numerically Controlled Crystal Boule Flat Grinder
Precision NC grinding machine that creates orientation flats on silicon or gallium arsenide crystal boules to indicate resistivity and conductivity type for semiconductor wafer slicing. Classified in HTS 8460.24.00.80 as numerically controlled grinding equipment using abrasives for cermet/semiconductor finishing per statistical notes on wafer preparation.