8460.24.00.80/Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules/Germany

Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules from Germany

This numerically controlled grinding machine precisely grinds semiconductor crystal boules to the exact diameter required for wafer production and creates flats indicating conductivity type and resistivity. Classified under HTS 8460.24.00.80 as a numerically controlled grinding machine for finishing metal or cermets using abrasives, specifically for semiconductor manufacturing preparation. It falls in the 'other' category for non-gear grinding applications.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Verify machine includes numerical control certification and specify semiconductor boule grinding capability in import documentation to avoid reclassification

• Provide technical specs confirming abrasive-based grinding for cermets/semiconductors; common pitfall is misclassifying as general metalworking equipment

• Ensure end-use statement for semiconductor manufacturing to qualify for potential duty relief programs