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8460.24.00.80/Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules/Japan

Numerically Controlled Wafer Grinder for Semiconductor Crystal Boules from Japan

This numerically controlled grinding machine precisely grinds semiconductor crystal boules to the exact diameter required for wafer production and creates flats indicating conductivity type and resistivity. Classified under HTS 8460.24.00.80 as a numerically controlled grinding machine for finishing metal or cermets using abrasives, specifically for semiconductor manufacturing preparation. It falls in the 'other' category for non-gear grinding applications.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Verify machine includes numerical control certification and specify semiconductor boule grinding capability in import documentation to avoid reclassification

• Provide technical specs confirming abrasive-based grinding for cermets/semiconductors; common pitfall is misclassifying as general metalworking equipment

• Ensure end-use statement for semiconductor manufacturing to qualify for potential duty relief programs