CNC Gallium Arsenide Wafer Polisher-Grinder

Numerically controlled combination grinder-polisher for gallium arsenide compound semiconductor wafers, achieving surface finish for epitaxial growth. HTS 8460.24.00.80 as NC abrasive finishing machine for cermets per statistical notes covering gallium arsenide processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
๐Ÿ‡จ๐Ÿ‡ณChina4.4%+35.0%39.4%
๐Ÿ‡ฒ๐Ÿ‡ฝMexico4.4%+10.0%14.4%
๐Ÿ‡จ๐Ÿ‡ฆCanada4.4%+10.0%14.4%
๐Ÿ‡ฉ๐Ÿ‡ชGermany4.4%+10.0%14.4%
๐Ÿ‡ฏ๐Ÿ‡ตJapan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.40.00Lower: 25% vs 39.4%

If compound semiconductor wafer processing

GaAs specific equipment typically goes to semiconductor machine provisions.

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Import Tips & Compliance

โ€ข Specify GaAs compatibility and epitaxial surface finish specs (RMS roughness values)

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