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8460.24.00.80/CNC Gallium Arsenide Wafer Polisher-Grinder/Japan

CNC Gallium Arsenide Wafer Polisher-Grinder from Japan

Numerically controlled combination grinder-polisher for gallium arsenide compound semiconductor wafers, achieving surface finish for epitaxial growth. HTS 8460.24.00.80 as NC abrasive finishing machine for cermets per statistical notes covering gallium arsenide processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify GaAs compatibility and epitaxial surface finish specs (RMS roughness values)

CNC Gallium Arsenide Wafer Polisher-Grinder from Japan — Import Duty Rate | HTS 8460.24.00.80